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2015123&ensp·&enspThe optical and electronic properties of semiconductor nanoparticles can be tuned through changes in their size and composition. However, poor contact between interfaces can degrade nanoparticle performance in devices. Dolzhnikov et al. report the synthesis of a gellike "solder" for metal chalcogenide nanoparticles, such as cadmium selenide and lead telluride, by crosslinking molecular
2011625&ensp·&enspmixing with Lead (Pb) solder or plating material is not advisable, as the alloy contains Bismuth. When Pb is present, a SnPbBi phase can form that has a melting temperature of 96°C. Although it is highly unlikely that this phase could form from a solder with only a 3% Bi
2013225&ensp·&enspMechanical Properties and Solder Joint Reliability of LowMelting SnBiCu Lead Free Solder Alloy Hisaaki Takao, Akira Yamada, Hideo Hasegawa Research Report Abstract The influence of alloy composition of lowmelting SnBiCu leadfree solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum
20121220&ensp·&enspAdvantages of Bismuthbased Alloys for Low Temperature PbFree Soldering and Rework Introduction negatively affect the solder joint quality, especially when coupled with Ga, In, Bi, and Cd are effective in reducing the melting temperature of solder alloys, although Cd is
2004730&ensp·&enspEffects of Bi Content on Mechanical Properties and Bump Interconnection Reliability of SnAg Solder Alloys The International Journal of Microcircuits and Electronic Packaging, Volume 23, Number1, First Quarter 2000 (ISSN 10631674)
2014116&ensp·&enspA leadfree solder composition includes: 3 wt % to 5 wt % of Ag, 0.2 wt % to 0.8 wt % of Cu, 1 wt % to 7 wt % of Bi, 0.005 wt % to 0.06 wt % of Ni, 0.005 wt % to 0.02 wt % of Ge, and the balance being Sn based on 100 wt % of the leadfree solder composition.
ECO SOLDER. LeadFree ECO SOLDER developed by SMIC offers high soldering reliability compared with the SnPb series solder of the past and is available in a wide product lineup according to the required soldering temperature. E series（antioxident type）and automatic feeding type for solder
201345&ensp·&enspEffects of Ag Content on the Mechanical Properties of BiAg Alloys Substitutable for Pb based Solder SHIMODA Masayoshi *, YAMAKAWA Tomohiro *, SHIOKAWA Kunio **, NISHIKAWA Hiroshi *** and TAKEMOTO Tadashi **** Abstract As one of the candidate materials for the hightemperatureresistant joining materials which substitute from the
The results show that SnBi solders do not wet bare copper well, but that they do wet copper having a hotdipped SnBi coating. Next, the effects of aging on the microstructure of SnBi solders are described. The results show that during aging, tin is depleted from the solder/base metal interface.
2019117&ensp·&enspSolder alloys are metallic materials that are used to connect metal workpieces. This is achieved by melting the alloy and then cooling it down. The choice of specific alloy depends on its melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ones areSolder alloys&ensp·&ensp
20131026&ensp·&enspAccording to the alloy composition they have different plastic ranges. 60/40 tin/lead alloy for example becomes liquid at 188°C (370°F) and therefore has a plastic range of 5°C (9°F), 40/60 tin/lead has a plastic range of 51°C (92°F). For appliions such as wave soldering of electronic assemblies, the requirement for a solder
Lead free solder composition is different from composition of leaded solder. There is NO Lead (Pb) is Lead Free solder. Lead Free Solder is taking rapid momentum around the world after the EU (European Union) Directives to wipe off lead (Poison) from electronic soldering considering its health and environmental effects.
20191015&ensp·&enspSolder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F 360 to 720 K), and is commonly used in electronics, plumbing, and sheet metal work.Leadfree solder&ensp·&ensp
Bi atoms up to 5 percent are expected to enter the Sn crystal lattice, Pb crystal lattice or both. Conclusion. The Sn/Pb/Bi ternary solder alloys containing 2 percent Bi demonstrated greater strength, a higher fatigue life and higher plasticity than 63Sn/37Pb eutectic solder
The composition of the asfabried binary Sn–Bi solder as measured by electron probe microanalyzer (EPMA, JXA8800M, JEOL, Japan) is 42.4 wt.% Sn–57.6 wt.% Bi, which is fairly close to the eutectic 42Sn–58Bi in the phase diagram. As to the ternary solder, the measured composition is 43.2 wt.% Sn–55.8 wt.% Bi–1.0 wt.% Cu.
2016629&ensp·&enspThe SnBi base leadfree solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional SnPb solders. So the alloying is considered as an effective way to improve the properties of SnBi solders with
A leadfree solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi not more than about 50 wt % In optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P and Sn.
20181122&ensp·&enspThis SnAgBiCu solder alloy (Sn96Ag2.5Bi1Cu0.5) is a rosincored and leadfree product. It is applicable for soldering highprecision electronic products and heatsensitive components. With noclean activated rosin flux inside, the tin silver bismuth copper alloy solder bars/wires show superior soldering performance.
solder/metallization interface significantly influences solder joint reliability. So, in this study, to elucidate the characteristics of the laser reflow soldering, we investigated the effect of heating method on the solder microstructure and the growth of IMC at the interface of a Sn–Ag–Cu solder bump and a Sn–Bi solder bump on a Cu pad. 2.